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Layered Solders

High-performance layered solders for critical metal combinations

Discover three-layer alloys that compensate thermal expansion and reduce stress fractures

Brazing hard metals with varying thermal expansion coefficients presents a significant challenge in modern joining technology. When components expand at different rates during temperature exposure, high internal stresses may occur – often leading to cracks or failure at the bonding interface. At LOT-TEK, we offer layered solders that provide a targeted solution to this problem.

Our three-layer solder alloys consist of two outer soldering layers and a central ductile copper layer. This copper core plays a crucial role in absorbing mechanical stresses, effectively buffering the mismatch in expansion between dissimilar materials. The result: permanent, stable joints – even under thermal cycling and demanding conditions.

Layered solders are ideal for applications in cutting tools, aerospace, and high-end electrical engineering. Whether you’re working with carbide, steel or complex metal assemblies, LOT-TEK delivers customized alloy solutions tailored to your process requirements.

Learn more about our full product range or visit our company page to explore our expertise in industrial soldering.

ProdukteCompositionAWSSolidus [°C]Liquidus [°C]
TRI40Ni240Ag30Cu28Zn2NiBAg-4660780Anfragen
TRI50Ni250Ag28Zn22Cu2NiBAg-24659707Anfragen
TRI49Cu49Ag23Zn16Cu7.5Mn4.5NiBAg-22680700Anfragen
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  • The range shown is only a selection of our products

Adapted for expansion differences – the core strength of layered solders

Precision bonding in high-stress material systems

LOT-TEK’s layered solders are engineered specifically to overcome one of brazing’s most critical challenges: joining metals with significantly different thermal expansion coefficients. Traditional single-layer alloys often fall short in applications where mechanical stress from temperature fluctuations can lead to microcracks and long-term damage.

Our solution: a three-part structure. The central copper layer acts as a flexible buffer that absorbs tension, while the outer solder layers ensure optimal wetting and strong metallurgical bonding. This combination is essential when brazing carbide tools or joining stainless steel with hard metals – especially under thermal cycling conditions.

Whether applied in aviation, tooling or medical devices, LOT-TEK’s laminated solutions ensure that sensitive assemblies stay intact – no matter the thermal load.

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Process safety and customization with LOT-TEK layered solders

From development to delivery – optimized for your application

In industries where safety and durability are paramount, LOT-TEK layered solders offer more than mechanical compensation. Our materials meet the stringent requirements of automotive, electrical engineering and vacuum technologies, where consistent, stress-resistant joints are key to long-term performance.

With our extensive expertise in layer architecture, copper ductility and interface metallurgy, we deliver tailored alloys that align with your specific brazing process – whether that’s induction, vacuum or controlled atmosphere. We also offer a variety of delivery forms including foils, preforms and rods, designed to simplify your workflow.

Our commitment doesn’t stop at material design. We support our partners with process consulting, testing services and feasibility studies to ensure that every soldering challenge is solved with maximum efficiency and minimal stress.

Let’s find the layered solder that fits your challenge:

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