Authorized Prince & Izant dealer
Authorized Prince & Izant dealer
Products
Gold Solders
| Produkt | Composition | ISO / UNS AWS | Solidus [°C] | Liquidus [°C] | |
| Gold Braze 92 | 92Au8Pd | Au 927 /P00927 BVAu-8 | 1200 | 1270 | Anfragen |
| Gold Braze 3034 | 30Au34Pd36Ni | Au 300 / P00300 BAu-5 | 1135 | 1169 | Anfragen |
| Gold Braze 5025 | 50Au25Ni25Pd | Au 507 / P00507 BVAu-7 | 1102 | 1121 | Anfragen |
| 10Au90Pd | 1063 | 1078 | Anfragen | ||
| Au 99.99 | 99.99Au | 1064 | 1064 | Anfragen | |
| Gold Braze 7008 | 70Au8Pd22Ni | Au 700 / P00700 BAu-6 | 1005 | 1037 | Anfragen |
| Gold Braze 35623 | 35Au62Cu3Ni | Au 351 / P00350 BVAu-3 | 1000 | 1030 | Anfragen |
| Gold Braze 2515 | 25Au37Cu10Ni15Pd13Mn | 970 | 1013 | Anfragen | |
| Gold Braze 3565 | 35Au65Cu | Au 354 / P00354 BVAu-9 | 990 | 1010 | Anfragen |
| Gold Braze 3762 | 37.5Au62.5Cu | Au 375 / P00375 BAu-1 | 985 | 1005 | Anfragen |
| Gold Braze 5050 | 50Au50Cu | Au 503 / P00503 BVAu-10 | 955 | 970 | Anfragen |
| Gold Braze 8218 | 82Au18Ni | Au 827 / P00827 BVAu-4 | 955 | 955 | Anfragen |
| 31Au33.5Cu9.75Ni9.75Pd16Mn | 927 | 949 | Anfragen | ||
| Gold Braze 8116 | 81.5Au16.5Cu2Ni | 910 | 925 | Anfragen | |
| Gold Braze 8020 | 80Au20Cu | Au 800 / P00800 BVAu-2 | 908 | 910 | Anfragen |
| Gold Braze 75 | 75Au20Cu5Ag | 885 | 895 | Anfragen | |
| Gold Braze 60 | 60Au20Cu20Ag | 835 | 845 | Anfragen | |
| 82Au18In | 451 | 485 | Anfragen | ||
| 88Au12Ge | 361 | 361 | Anfragen | ||
| 80Au20Sn | 280 | 280 | Anfragen |
In the medical sector, there is no room for compromise. Gold solder alloys offer inert, clean bonding characteristics essential for devices that come into direct contact with the human body. From implantable electronics to surgical assemblies, our materials ensure long-term safety and flawless metallurgical bonds.
Explore our medical industry solutions
Thermal shock, vibration, altitude pressure changes – aerospace components must endure it all. Gold solder alloys are proven to maintain electrical and mechanical stability across wide temperature ranges. Whether in avionics or sensor arrays, they ensure mission-critical consistency.
Learn how we support aerospace applications
Signal clarity and conductivity are crucial in modern electronics. Our gold-based alloys form low-resistance joints with excellent wetting, particularly on iron-, nickel-, and cobalt-based substrates. This makes them the preferred choice for microelectronics and RF technology.
See where our alloys are used in electrical engineering
Control units, battery systems, and sensors in vehicles operate under constant stress. Gold solder alloys provide thermal fatigue resistance and stable conductivity, making them ideal for electric mobility and hybrid systems.
Find out how we serve the automotive industry
In high-performance tooling, soldered joints must withstand both mechanical and thermal loads. Gold solder alloys offer dimensional stability and low void formation, essential in cutting tools, bonding tools, and custom machinery.
Read more about tooling applications
What gives our gold solders this kind of versatility? Let’s take a closer look at the properties and key advantages of our gold solder alloys.
———-Unlike standard solder materials, gold solder alloys resist chemical breakdown—even in long-term exposure to air, humidity, or process chemicals. This makes them the top choice for harsh environments, including vacuum applications and exposed assemblies.
Gold solder for vacuum tube technology
Our gold solders deform without cracking. This plastic flexibility absorbs stress in dynamic assemblies, such as moving implants or vibrating systems, maintaining stable joint integrity over thousands of cycles. It’s ductility you can depend on—measured and reproducible.
Whether bonding to nickel, iron, or cobalt alloys, our gold solder alloys deliver uniform wetting and clean interface formation. This ensures consistent conductivity and mechanical hold—without voids, inclusions, or post-solder defects.
In vacuum or inert gas conditions, our gold alloys require no flux at all. This enables ultra-clean joints without post-solder cleaning. If a flux is required, we provide boric acid-based options specifically formulated for noble metal soldering.
In the next section, learn how we offer our alloys: discover the available formats and compositions of our gold solder alloys to perfectly match your process environment.
Every production line has its own rhythm. That’s why our gold solder alloys are available in a wide range of formats to fit your specific process – from high-volume automation to manual micro-assembly. Whether you need gold solder wire, preforms, foils, paste or custom shapes, we deliver with precision and consistency.
We offer proven alloy systems like AuSn 80/20, AuGe, and AuSi, along with customized compositions designed around your specific bonding requirements. Want to fine-tune melting point, thermal expansion, or ductility? Our application engineers help identify or create the ideal alloy formula for your process.
From screen-printable powders to laser-cut preforms and ultra-thin ribbons, our solder formats enable efficient application across multiple industries. We also provide gold solder spheres, discs, and segmented parts for specialized use in microelectronic packages or high-precision optics.
Your requirements don’t stop at physical format. All our gold solder alloys come with full documentation, batch traceability, and optional certifications. We meet industry-specific quality standards for aerospace, medical and electronic sectors – down to the micron.
To get the best out of your soldering process, knowing how to apply gold alloys correctly is essential. In the next section, we explore soldering techniques and technical parameters that unlock the full potential of our materials.
———-One of the unique strengths of gold solder alloys is their ability to be processed without flux in inert or vacuum conditions. This eliminates the need for post-cleaning and guarantees a pristine joint interface—ideal for sensitive applications in aerospace and medical systems.
Gold solder alloys feature narrow, well-defined melting intervals. This supports tight thermal process control, especially in automated environments. Whether using furnace brazing, laser soldering, or induction heat, our alloys behave predictably—minimizing risk and maximizing yield.
Bonding to challenging base metals like iron, nickel, or cobalt? Our gold solders are specifically engineered for excellent wetting and diffusion on these materials. The result: joints that are strong, clean, and metallurgically stable under demanding loads.
Our materials are developed with controlled-atmosphere processing in mind. From glovebox integration to high-vacuum chamber systems, LOT-TEK solder alloys offer repeatable performance and clean melting behavior without flux residue contamination.
But even the best alloys need the right partner. In the next section, we explain why LOT-TEK is the trusted source for precision gold solder solutions across industries worldwide.
———-Whether you’re in R&D or running full-scale production, LOT-TEK understands your goals and your constraints. Our experts work alongside engineers, buyers, and process developers to provide not just a product—but a solution. We bridge the gap between material science and real-world applications.
We don’t stop at material delivery. Our application engineers support your entire workflow, from solder selection to process integration. Need guidance on thermal profiles or substrate compatibility? We’re here to help—fast, qualified, and goal-focused.
Our production follows strict quality assurance protocols, with documented traceability for every batch. We meet or exceed standards in sectors like aerospace, medical technology, vacuum electronics, and semiconductor packaging. Your standards are our baseline.
We supply companies across Europe, North America, and Asia with reliable, certified gold solder alloys. Despite our reach, our mindset remains personal: short communication paths, technical depth, and a strong commitment to your success.
Ready to talk about your project?
Get in touch with us today – and let’s build the right bonding solution together.
