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Paste & Powder

Solder Pastes & Powders – Engineered for Precision and Process Stability

LOT-TEK delivers ready-to-use materials for automated and high-precision soldering

Whether for fine-pitch electronics, stencil printing or jet and dispenser systems – LOT-TEK provides high-performance solder pastes and metal powders tailored to the specific demands of industrial soldering. Our materials ensure stable viscosity, defined melting behavior and low-residue performance, even in highly automated production environments.

Each paste formulation is built on clean metal powders and specially designed flux systems, allowing for optimized wetting, spreading and joint reliability. Particle sizes and alloy types are selected based on your application, and we offer full customization for metal content, flux chemistry and rheological properties.

Learn more in our product overview or discover use cases in electrical engineering, medical devices or vacuum tube technologies. Contact us directly via our online form for expert consultation.

ProductProperties
Tinngood wetting behaviour low shrinkage cavity formationAnfragen
Silver / TinnHigh melting point High corrosion resistance High thermal conductivity High tensile strengthAnfragen
Silver / Copper / Tinnhigh strength suitable for connections that require ductilityAnfragen
Partikelgröße [mm]Mesh-zahlAction
0.038400Inquiry
0.045325Inquiry
0.074200Inquiry
0.110140Inquiry
0.149 100Inquiry
0.17780Inquiry
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  • The range shown is only a selection of our products

Solder Pastes for Consistent Results in Automated Processes

Reliable wetting and optimized flow for jetting, printing and reflow

LOT-TEK solder pastes are developed for maximum stability and repeatability in precision soldering processes. Each formulation combines high-purity metal powders with a flux system designed for consistent wetting, minimal residue and clean solder joints – even in complex geometries or fine-pitch assemblies.

We offer pastes with adjustable parameters: metal load, particle size, viscosity and activator content. Whether for stencil printing, jetting or dispenser application, each batch is manufactured under controlled conditions and fully documented for traceability.

Our no-clean, halogen-free or water-soluble flux systems can be tailored to your reflow or vacuum process. This makes them ideal for demanding environments such as medical devices, PCB assembly or sealed systems where residue control and joint quality are critical.

Customers benefit from consistent rheological behavior, precise dosing performance and reliable joint strength – with full support from LOT-TEK’s engineering and quality teams.

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Metal Powders for Soldering, Additive Manufacturing and High-Purity Applications

LOT-TEK powders ensure optimal flow, clean melting and long-term reliability

In addition to pastes, LOT-TEK provides metallic solder powders for advanced manufacturing environments. These powders feature tightly controlled particle size distributions and excellent flow characteristics – making them suitable for precise dosing, printed electronics, laser soldering and even additive manufacturing.

Available in silver, gold, copper, nickel and tin-based alloys, LOT-TEK powders meet the highest standards of purity and metallurgical stability. Depending on your needs, we offer particle size classes from sub-25 μm up to 75+ μm, with custom surface treatments available for oxidation protection or wetting enhancement.

Our powders are widely used in tool manufacturing, medical technology and automotive electronics. All materials are packaged under controlled conditions, with batch documentation and optional vacuum sealing for shelf-life optimization.

Whether you need ready-to-use powder for hybrid manufacturing or a custom alloy for fine-pitch dosing – LOT-TEK supports your production with material expertise and flexible logistics.

Contact LOT-TEK today for the right powder or paste solution for your application »