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ChannelFlux®

ChannelFlux® – engineered precision in flux-coated soldering

A patented innovation for clean, reliable joints and maximum process safety

When precision, cleanliness, and reliability are essential in your soldering process, ChannelFlux® stands out as a game-changing innovation. Developed by Bellman-Melcor, a trusted division of Prince & Izant, this technology is protected by US Patent #7,858,204 and offers a unique geometric solution for flux-coated solders.

Unlike conventional flux-core or fully-coated solder wires, ChannelFlux® features a clearly defined exposed channel that is precisely filled with a soft, formable flux. This architecture ensures that the flux remains stable and properly positioned throughout the handling and forming process—only activating exactly when needed.

The benefits are manifold: the flux melts and activates the surfaces before the solder liquefies, ensuring superior wetting. It remains in direct contact with the joining partner, minimizing the risk of trapped flux and hidden defects. Moreover, the channel design allows the solder to be formed into virtually any practical shape without compromising performance.

With ChannelFlux®, you achieve clean, repeatable and defect-free joints—ideal for demanding industrial environments where precision and process safety are non-negotiable.

productComposition/ Flux content and systemApplicationSolidus [°C]Liquidus [°C]
4047 (#718)88Al12Si / 22% KA1F & CsA1F-based polymer systemAutomotive & HVACR577582Anfragen
ZA-178Zn22Al / 16% cesium-based polymer systemHVAC, evaporator coil repair, suitable for automatic feeding systems441471Anfragen
ZA-298Zn2Al / 14% cesium-based polymer systemRepair soldering of evaporator coils in production environment379385Anfragen
ZA-399.5Zn0.5Cu 14% Cesium-based polymer systemfor soldering copper to aluminum 420440Anfragen
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Reliable flux activation through intelligent channel design

How ChannelFlux® ensures optimal timing and surface interaction

The defining feature of ChannelFlux® is its precision-engineered open channel, pre-filled with a soft, stable flux that only activates when truly needed. This design sharply contrasts with traditional flux-cored wires or fully coated solder forms, where flux distribution is often uncontrolled, leading to early evaporation, surface contamination, or weak bonding. By isolating the flux within a clearly exposed groove, ChannelFlux® delivers exceptional control over the activation process—ensuring that flux begins to interact with the base materials precisely when required during heating.

In technical applications where consistent performance is crucial—such as in electronics manufacturing, sensor assemblies, or fine mechanical components—this controlled activation helps prevent cold joints, solder voids, and flux residues that may cause failures over time. Once heating begins, the channel’s flux melts ahead of the solder alloy, preparing the surfaces through thorough wetting and oxidation removal. This improves joint quality and promotes a reliable metallurgical bond.

Moreover, the exposed flux remains in direct contact with the joining partner throughout the process, minimizing the risk of voids or entrapments. This reduces the need for post-soldering cleaning steps and supports higher throughput in automated production environments.

At LOT-TEK, we offer ChannelFlux®-based materials as part of our advanced product portfolio for demanding applications. Whether your process requires precision under vacuum conditions or clean soldering in sensitive assemblies, ChannelFlux® ensures repeatability, cleanliness, and strong joints—backed by patented technology and deep expertise.

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Formability and application flexibility across industrial use cases

ChannelFlux® adapts to custom geometries without compromising functionality

One of the most practical advantages of ChannelFlux® lies in its outstanding mechanical formability. Unlike many flux-coated wires or filled preforms, ChannelFlux® maintains its structural and functional integrity even when bent, pressed, or reshaped into complex geometries. This allows engineers and production specialists to design application-specific solder forms—such as rings, shims, or pre-sized elements—that precisely match the contours and spatial constraints of the component to be joined.

This flexibility proves especially valuable in automated or semi-automated manufacturing environments, where repeatability, space efficiency, and process timing are critical. ChannelFlux® enables uniform flux distribution across all formed units, ensuring predictable behavior during heating cycles—whether through furnace brazing, induction heating, or handheld torch applications. The flux stays centered in the exposed channel, avoiding unintentional displacement or inconsistency.

LOT-TEK customers across diverse industries rely on this technology to meet specific compliance, performance, and material demands. From aerospace and medical to electronics and sensor technology, ChannelFlux® eliminates manual fluxing steps, reduces residue, and improves overall joint quality—ensuring robust results in critical environments.

By integrating ChannelFlux® into your production process, you ensure both geometric adaptability and process stability—without compromising quality, efficiency, or control.

Contact LOT-TEK today to explore ChannelFlux® solutions tailored to your industry »